TOKUYAMA® EE-BOND

TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama’s 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.
Product Support Link
Product Sheet Clinical Procedure Guide Instruction Manual Technical Report
Features&Benefits
  • Outstanding adhesion performance
  • Dependable marginal integrity (Minimized micro-leakage)
  • Reduced post-operative sensitivity
  • Perfect cavity sealing
  • Less technique sensitivity
  • Prolonged working time
  • Fluoride releasing
Indications
Bonding of light- or dual-cured composite to:
  1. cut/uncut enamel
  2. cut/uncut dentin
  3. fractured porcelain/composite repair
Simple Steps
Direct restorations and Intraoral repair of restorations with Composite Resin
Dependable Marginal Integrity
No marginal leakage observed.(Result of dye immersion test*)
Product Packages Available
TOKUYAMA® EE-BOND Intro Kit
  • EE-BOND Bottle / 5mL
  • Applicator x 25
  • Dispensing well
  • TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
  • Syringe Tip x 10
TOKUYAMA® EE-BOND Intro Kit
TOKUYAMA® EE-BOND Refill
  • EE-BOND Bottle / 5mL