Bonding Agents -Enamel-Etching Bonding System-

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TOKUYAMA® EE-BOND

TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

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Benefits

  • Outstanding adhesion performance
  • Dependable marginal integrity (Minimized micro-leakage)
  • Reduced post-operative sensitivity
  • Perfect cavity sealing
  • Less technique sensitivity
  • Prolonged working time
  • Fluoride releasing

Indications

  • Bonding of light- or dual-cured composite to:
    1. cut/uncut enamel
    2. cut/uncut dentin
    3. fractured porcelain/composite repair

Simple Procedure

Dependable Marginal Integrity

  • No marginal leakage observed.(Result of dye immersion test*)

Physical Properties

  • *Not a registered trademark of Tokuyama Dental Corp.
    **Source: Tokuyama Dental R&D

Product Packages Available

TOKUYAMA® EE-BOND Intro Kit

  • EE-BOND Bottle / 5mL
  • Applicator x 25
  • Dispensing well
  • TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
  • Syringe Tip x 10
TOKUYAMA® EE-BOND Intro Kit

TOKUYAMA® EE-BOND Refill

  • EE-BOND Bottle / 5mL